Contract: HONEYWELL INTERNATIONAL INC.
HONEYWELL INTERNATIONAL INC.
CDFA Program Title
The purpose of this Task is to develop silicon carbide (SiC) device technologies used in advanced Army platform power systems. Improvements in components technologies under this task will allow Army power systems in wheeled and mobile platforms to meet p
Recipients Connected to Award
|SPANG & COMPANY||Sub-recipient||$1,800,000.00|
|HONEYWELL INTERNATIONAL INC.||Primary recipient||$1,112,676.00|
|GENERAL ELECTRIC COMPANY||Sub-recipient||$1,100,000.00|
|ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.||Sub-recipient||$1,066,647.00|
|DOW CORNING CORPORATION||Sub-recipient||$901,427.00|
|DEARBORN ELECTRONICS, INC.||Sub-recipient||$745,800.00|